ed3design-engineering-bundles

License: MIT

Engineering-discipline library for Claude Code power users — hardware/maker focus. 8 skills across 3 thematic bundles covering parametric CAD, FDM/maker workflows, and embedded systems integration.

Sibling to ed3design-skill-bundles (software-engineering focus). This repo concentrates on the physical engineering disciplines: CAD design, 3D-printed builds, embedded device onboarding.

📦 Bundles

Bundle Skills Status
cad-design 5 (CAD API scripting, construction workflows, mechanical design principles, image-to-mesh, Fusion MCP-Bridge) 🟡 v0.1.0 alpha
maker-fdm 2 (BOM validation, embedded GUI documentation) 🟡 v0.1.0 alpha
embedded-systems 1 (Victron Cerbo GX Modbus onboarding — Enabled=0 default trap) 🟡 v0.1.0 alpha

Total: 8 skills + 1 helper tool — patterns extracted from real-world physical engineering practice and structured for reuse.

[!NOTE] Status is alpha until the first signed v0.1.0 Git tag is published. All bundles currently pass claude plugin validate --strict via CI on every PR, but no stable release has been cut yet. Treat the install instructions as pre-release for now.

🚀 Quickstart

Via Claude Code Marketplace

/plugin marketplace add Ed3Design/ed3design-engineering-bundles
/plugin install cad-design@ed3design-engineering-bundles
/plugin install maker-fdm@ed3design-engineering-bundles
/plugin install embedded-systems@ed3design-engineering-bundles

Manual Install

git clone https://github.com/Ed3Design/ed3design-engineering-bundles
ln -s "$(pwd)/ed3design-engineering-bundles/cad-design/skills"/* ~/.claude/skills/
ln -s "$(pwd)/ed3design-engineering-bundles/maker-fdm/skills"/* ~/.claude/skills/
ln -s "$(pwd)/ed3design-engineering-bundles/embedded-systems/skills"/* ~/.claude/skills/

🧭 Why a separate repo from ed3design-skill-bundles?

The software-engineering bundles (token-savers, code-quality, planning, schema-discipline, etc.) share an audience: developers who write code. The hardware/maker bundles share a different audience: makers, mechanical engineers, embedded-systems hobbyists. Splitting them into two repos makes discovery clearer for both audiences and lets each repo grow without bloating the other.

🔗 Related

  • ed3design-skill-bundles — software engineering: token optimization, code quality, planning, async/SQL debugging, skill-system meta
  • ed3design brand: maker-focused engineering tools for makers, makers' AI workflows, and CAD/3D-printing automation

📚 Pattern Compound

A typical hardware engineering session might layer these bundles:

  1. cad-design — design the part (parametric CAD, MCP-Bridge for closed-loop iteration)
  2. maker-fdm — validate the BOM before ordering, document the embedded UI from source
  3. embedded-systems — onboard the new Victron/Modbus device on first connection

Each bundle works standalone, but loaded together they cover the design → build → integrate flow end-to-end.

License

MIT. See LICENSE.